Yoichi SASADA

Professional Experience

Mr. Sasada is a new associate at SUGIMURA. Prior to joining SUGIMURA, he served as a project manager in the electronics packaging technologies field at Fujitsu and its affiliates. He located in San Jose, San Diego and Dallas in the States for technological management of global business for a total of several years. He has particular expertise in the area of semiconductor package, ultra-high density PWB assembly and System in Package (SiP) for various mobile devices, radio frequency identification (RFID) and low power sensor network (ZigBee, etc.). He also serves as a committee member of the Printed Wiring Board WG to write “Japan Packaging Technology Roadmap” at Japan Electronics & Information Technology Industries Association (JEITA).

Education

B.S., Electrical Engineering, Waseda University

Practice Areas

Patent Prosecution (electrical engineering, Telecommunication, IT, IoT)

Languages

English
Japanese